Ceramic and Metal Coating Services

Deposition methods

DC/RF Sputtering , Thermal evaporation , E-beam evaporation etc..

Film thickness uniformity

4" : Sputtering (less than 3%) , Evaporation (less than 5%)

Thin film materials

Metals: Pt , Au , Ni , Cu , Ni+Cr , W , Cr , Ti , Si , Ta , Al etc..
Oxides: TiO2 ,ITO , IZO , SiO2 etc..  
Energy materials: LiCoO2, LiMnO2, LiPON, Li, Li2S etc.

Process Flow Chart

Wafer appearance checkClean before processDepositionTaping TestAir Zero Packing

Process equipment

  • Co-Sputter system
  • Gold coater
  • Thermal Evaporation
  • E-beam Evaporation
  • Rapid Thermal Annealing System